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The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
EMC COMPO 2019 IN
HAINING, HANGZHOU, CHINA
October 21-23, 2019, Haining, Hangzhou, China
Support Enterprises
International Technical Committee
NameAffiliation
Adrijan BaricUniversity of Zagreb
Alexandre BoyerLAAS-CNRS
Andre DurierIRT St Exupery
Bernd DeutschmannTechnical University of Graz
Bertrand VrignonNXP Semiconductors
Bob ScullyNASA Johnson Space Center, USA
David PommerenkeMissouri University of Science and Technology
Davide PandiniST Microelectronics
En-Xiao LiuA*STAR
ErPing LiZhejiang University
Etienne SicardINSA Toulouse
Fabian VargasPontifícia Universidade Católica do Rio Grande do Su
Franco FioriPolitecnico di Torino
Frank KlotzInfineon
Frederic LafonValeo
HarkByeong ParkSamsung
Hideki SasakiRenesas Electronics Corporation
Hugo PuesMelexis
Hyun Ho ParkThe University of Suwon
Jack KruppaInfineon
Jan NiehofNXP Semiconductors
Jean-Michel RedouteMonash University
Jeremy RaoultMontpellier University
Jianfei WuNational University of Defense Technology
John DawsonUniversity of York
Jun FanMissouri University of Science and Technology
Kamel AboudaNXP Semiconductors
Kieran O' LearyMixed Signal Systems
Lijun JiangUniversity of Hong Kong
Mart CoenenEMCMCC
Masahiro YamaguchiTohoku University
Matthieu DelogeNXP Semiconductors
Mauro MerloST Microelectronics
Mohamed RamdaniESEO Angers
Osami WadaKyoto University
Renaud GillonON Semiconductor
Richard PerdriauESEO Angers
Sergey MiropolskyInfineon
Sergey ShaposhnikovSaint Petersburg Electrotechnical University
Shih-yi YuanFeng Chia University
Sonia Ben DhiaLAAS-CNRS
Thomas SteineckeInfineon
Todd HubingClemson University
Tzong Lin WuNational Taiwan University
Umberto PaolettiHitachi Ltd.
Wolfgang WilkeningBosch
The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
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